Kua angitu a Resonac ki te processing i tētahi papanga SiC kristal kotahi e 300 mm, e 12 inihi te diamètre. Ko te rahi papanga e pā ana ki te 150 mm i tēnei wā. Ka taea e te whakamahinga whānui o ngā papanga 300 mm te tautoko i ngā semikonduka mana e pēnā ana i te whakangao pūngao me te whakaiti i ngā utu hanga nui. Ko te pupuri i te rahi papanga parepare puta noa i tērā rahi nui he wero tonu.
Ko ngā papanga he rahi crystalline ngā riu e whakarato ana i te tūāpapa hei whakaputa i ngā wafers SiC epitaxial e whakamahia ana e ngā kaihanga semikonduka mana. I te wā nei, ko Resonac e aro ana ki ngā papanga 150 mm, e tuku ana ki ngā kamupene koha motokā me ngā kaiwhakanao pūoko semikonduka, tae atu ki a Rohm, e whakaputa ana i tā rātou ake wafers. E ai ki ngā hoko i waho, ko Resonac te hold te rahi rawa o te mākete ao, i muri i a Wolfspeed i te U.S.
Ko te piki haere o te hiahia ao mō ngā pokanga raraunga e kawe mai ana i te aro nui ki ngā wafers SiC. I te whakataurite ki ngā wafers silicon tuku iho, e pai ana te pūngao o te SiC a ka taea te whakaiti i ngā ngaronga pūngao ka pā ki te whakaputanga wera. E matapae ana te kamupene rangahau ko Fuji Keizai ka piki te mākete global mō ngā wafers semikonduka mana ki te tata ki te toru te tāuru o tōna rahi i te 2025 i te 2035, ka tōna wā ko ngā wafers SiC e tērā pea ko te iti iho i te 70% o te mākete.
Ko te pikinga o te diamètre o ngā wafers he wero matua mō te ahumahi. I runga i te wāhi, ko ngā wafers 300 mm e pā ana ki te 70% o te mākete wafers silicon, kātahi ka noho hei tauira paerewa mō te hanga semikonduka. Kāore ngā papanga SiC o te diamètre kotahi i tae atu ki te whakaputanga hanga hōhonu.
Ko te mea kotahi ko te tikanga tipu kiri e hiahiatia ana ki te whakaputa i ngā wafers SiC epitaxial e pa ana ki ngā pāmahana teitei atu i te 2,000 ngā pūtau Celsius, e waiho ai te rauemi ki te pānga ki ngā hapa. Ko ngā ingots SiC e whakamahia ana i roto i te whakaputanga wafer epitaxial he tino kōhatu, e hiahiatia ana ngā tikanga whai pānga ki te whakahiato me te paraihe i a rātou ki ngā papanga paraihe me te rahi parepare.
I tūtohu a Resonac i te Hanuere 2023 i roto i te whakakotahitanga o Showa Denko me Showa Denko Materials, e mohiotia ana kāore e tuhia hei Hitachi Chemical. I pānuitia e Showa Denko te mākete wafer SiC epitaxial i te 2009, ka huri haere i ngā diamètre wafers i te 76.2 mm, e 3 inihi, ki ngā rahi nui atu.
E ai ki a Hiromasa Suo, e whakahaere ana i te whakawhanaketanga hangarau rauemi semiko i te waahanga rongoā taputapu o Resonac, kua kohikohia e te kamupene he kete mōhio kei te processing i ngā papanga rahi atu i te whakawhanaketanga me te whakaputa mass o ngā papanga SiC tuku iho. Ko tēnei mōhiohio e pā ana ki te pupuri i te pāmahana tika i te wā e tīmata ana te whakamātau me ngā tikanga ki te whakaiti i te pānga e taea ai te hanga ngā papanga ki te āhua pōkai, ki te pakaru.
I te wā nei, ko ngā kamupene U.S. me te Hainamana e ārahi ana i te whakawhanaketanga o ngā papanga SiC 300 mm. I panuitia e SICC i te marama o Noema 2024 kua whakawhanakehia e ia te papanga SiC 300 mm tuatahi o te ahumahi, i te wā e angitu ana a Wolfspeed ki te whakaputa i te papanga kristal kotahi i te marama o Hanuere i tēnei tau.
Kāore he kamupene i tīmata i te whakatūwheratanga teitei. E hiahia ana ngā kaihanga semikonduka mana ki te whakangao i ngā haumi nui i ngā taputapu whakaputa. Ko te whakatutuki i tētahi āheinga utu whai take me pā hoki ki te pūnaha tuku e kaha ana ki te whakaputa i ngā papanga teitei nōna e pā mō te take nui.
I te wā nei, ko Resonac e whakaaro ana ki te whakawhanake i ana rawa mō ngā papanga 200 mm. I te wā ko ngā hua 200 mm ka whakakī i ngā hua 150 mm, ka arotake te kamupene i te potential mākete o ngā papanga 300 mm i runga i te hiahia o te kiritaki.
I kī a Resonac CEO ko Hidehito Takahashi e pā ana ki te ara whakataetae mō te mākete 300 mm kāore i te hanga āhua. Ka whakaaro te kamupene ki te whakangao mēnā ka tupu te hiahia o ngā kiritaki ā ka kite ia i tētahi āheinga ki te tango i te painga tuatahi.
Mai i te Hanuere ki te Pipiri 2026, ko te pakihi rauemi semikonduka me ngā rauemi hiko i whakaputa ake i te 90% o te moni whakahaere matua a Resonac. I panuitia e te kamupene te moni whakahaere matua e 88.8 piriona yen, e tata ana ki te $564 miriona, mō te wā. Ko ngā pūtake pā tēnā i roto i te pāinga a Resonac kei roto ko ngā rauemi e whakamahia ana i te hanga semikonduka i te taha tuarua, pērā i ngā rauemi pūtake me ngā rauemi whakamahana.
I kii nga kaiwhakahaere Hapanihi ka taea e Resonac te whakatutuki i nga painga nui ma te whakawhānui i tona awhi i roto i nga hau-pūmau teitei me nga rauemi whakapaipai teitei e whakamahia ana i roto i te hanga taura tuatahi, me te whakawhanake i te mohio ki te hanga wafera, te tikanga tuatahi o te tukanga front-end. Ma te pokanoa i nga tikanga whakaputa whanui ka taea e te kamupene te awhina i nga kaitiaki ki te rongoā i nga wero hangarau.
I whakapumautia hoki e te kaiwhakahaere ahumahi semiconductor Hapanihi he pārekareka. I kii ia kua taimaha te Hapanihi ki nga kaiwhakataetae i o waho na te mea i ngoikore te ahumahi semiconductor o Hapanihi i tetahi rautaki whakawhanake whakariterite, engari ka taea e nga paparahi SiC 300 mm te noho hei hangarau nui i roto i te hokinga mai o te ahumahi o te whenua.