Ko te whakatutukitanga matua i muri mai i te pūnaha packaging 2.1D he piriti taiao e ngā kōwae. Ko tāna hanganga ka rite ki te Hangarau Piri Multi-die o Intel, arā ko EMIB, engari kei te whakakapi i te piriti silico e whakamahia ana i te EMIB, me te hanganga i hangaia mai i ngā rauemi taiao e whakamahia ana i ngā papa pātea tā. Ko te piriti taiao he ōkawa mahoatanga e whakapiri ana i ngā kōwae toharite e rima ki te whitu. Kei te anga ki te whanui me te waahi o 1.5 ki te 2 micrometas, ngā rahi hengarua o 4 ki te 5 micrometas, me te teitei mō ngā tauira hiko e 500 ki te 1,000 rārangi i ia mirimita, e hanga ana i ngā ara hono tere i waenga i ngā chiplets.
Ko te hanga piriti taiao he iti ake te utu i te hanga piriti silico, ā, ka taea hoki te karo i ngā ārai patent e pā ana ki te hangarau EMIB a Intel. I tēnei wa, kei te arotake te kaupapa i te mahi me te pono o ngā papa FC-BGA e whai wāhi ana i ngā piriti taiao e ngā kōwae. Ko te tono tino ko ngā pūnaha rorohiko AI rahi a Qualcomm mō ngā pokapu raraunga. I tuhinga te pūrongo i tukuna e Qualcomm he tono patent e pā ana ki te hangarau piriti hono i te Oketopa 2024, ā, i tīmata te kimi i ngā rangahau hangarau piriti taiao i Korea ki te Tonga i te Māehe 2025.
I tua atu i tāna mahi ki a Qualcomm, kei te whakawhanake tahi te Samsung Electro-Mechanics i ngā papa packaging e whakawhirinaki ana ki te piriti taiao ki te maha atu o ngā kiritaki. Kua tautuhia e te kamupene te hangarau hei wāhi tipu mō tāna pakihi packaging matatau. Kei te pikinga te pākaha mō ngā papa packaging matatau me ngā rongoā hono chiplet i te whakapau kaha o te rorohiko AI. Ko te nuinga o ngā rongoā packaging 2.5D e whakawhirinaki ana ki ngā interposers silico, ki ngā piriti silico, e tāpiri ana i te utu nui. Ko te hangarau piriti taiao e hiahia ana ki te whakaatu i te taurite hōu i waenga i te rūnanga me te utu hanga.
Ka whakamahi te EMIB i ngā piriti silico e pā ana ki ngā wāhi e hiahia ana i te kōrero hei te whakawhanui i te rohe i waenga i ngā chip, i te mea ka mōhio tonu te pūnaha ki te papa taiao. Ko te otinga piriti taiao a Samsung Electro-Mechanics e whai ana i te āhua piriti whakahuri kāore i ngaro, engari kei te whakakapi i te piriti silico ki te rauemi papa taiao.